3D Packaging Publications

1. Jacob Minz and Sung Kyu Lim, "Layer Assignment for System-on-Packages," ACM/IEEE Asia and South Pacific Design Automation Conference, p31-37, 2004. (pdf)
2. Jacob Minz, Mohit Pathak, and Sung Kyu Lim, "Net and Pin Distribution for 3D Package Global Routing," Design, Automation and Test in Europe, p1410-1411, 2004. (pdf)
3. Ramprasad Ravichandran, Jacob Minz, Mohit Pathak, Siddharth Easwar, and Sung Kyu Lim, "Physical Layout Automation for System-On-Packages," IEEE Electronic Components and Technology Conference, p41-48, 2004. (pdf)
4. Pun Hang Shiu, Ramprasad Ravichandran, Siddharth Easwar, and Sung Kyu Lim, "Multi-layer Floorplanning for Reliable System-on-Package," IEEE International Symposium on Circuits and Systems, p69-72, 2004. (pdf)
5. Jacob Minz, Sung Kyu Lim, Jinwoo Choi, and Madhavan Swaminathan, "Module Placement for Power Supply Noise and Wire Congestion Avoidance in 3D Packaging," IEEE Electrical Performance of Electronic Packaging, p123-126, 2004. (pdf)
6. Jacob Minz and Sung Kyu Lim, "A Global Router for System-on-Package Targeting Layer and Crosstalk Minimization," IEEE Electrical Performance of Electronic Packaging, p99-102, 2004. (pdf)
7. Jacob Minz, Eric Wong, and Sung Kyu Lim, "Thermal and Crosstalk-Aware Physical Design For 3D System-On-Package," IEEE Electronic Components and Technology Conference, P824-831, 2005. (pdf)
8. Eric Wong, Jacob Minz, and Sung Kyu Lim, "Power Noise-aware 3D Floorplanning for System-On-Package," to appear in IEEE Electrical Performance of Electronic Packaging, 2005. (pdf)
9. Sung Kyu Lim, "Physical Design for 3D System-On-Package: Challenges and Opportunities," IEEE Design & Test of Computers, Vol. 22, No. 6, p532-539, 2005. (pdf)
10. Jacob Minz, Eric Wong, Mohit Pathak, and Sung Kyu Lim, "Placement and Routing for 3D System-On-Package Designs," to appear in IEEE Transactions on Components and Packaging Technologies.
11. Jacob Minz and Sung Kyu Lim, "Block-level 3D Global Routing With an Application to 3D Packaging," to appear in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
12. Jacob Minz, Somaskanda Thyagaraja, and Sung Kyu Lim, "Optical Routing for 3D System-On-Package," to appear in Design, Automation and Test in Europe, 2006.
13. Eric Wong, Jacob Minz, and Sung Kyu Lim, "White Space Management for Thermal Via and Decoupling Capacitor Insertion Targeting 3D System-On-Package," to appear in IEEE Electronic Components and Technology Conference, 2006.
14. Eric Wong, Jacob Minz, and Sung Kyu Lim, "Multi-objective Module Placement For 3D System-On-Package," IEEE Transactions on Very Large Scale Integration Systems, Vol. 14, No. 5, pp. 553-557, 2006.