3D Integration Research at Georgia Tech
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Welcome to the Georgia Tech 3D Integration Research website! Our mission is to provide insights as well as automated tools, microarchitectures and circuits to design highly optimized 3D processors, 3D mixed-signal System-On-Chips, and 3D mixed-signal System-On-Packages. We achieve this goal by tackling the 3D design issues at multiple levels of abstractions: microarchitecture, circuit, packaging.

PEOPLE

Faculty 3D Microarchitecture Team 3D Circuit and Package Team
Hsien-Hsin S. Lee (ECE)
Sung Kyu Lim (ECE)
Gabriel H. Loh (CoC)
Michael Healy
Dae Hyun Kim
Jonathan Kron
Dean Lewis
Mohit Pathak
Young Joon Lee
Xin Zhao
Krit Athikulwongse
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GT 3D Integration Research
Georgia Institute of Technology
Last modified 30 May '08